MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool Size:XZW25 0.76mm 0 S0 S1 S2 △2

0 S0 S1 S2 △2

All Languages Of The World Without Exception

1x iPhone 15 series 4 in 1 heating mold with stencil

Interface Specification :

5 or higher

MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool Size:XZW25 0.76mm 0 S0 S1 S2 △2MECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools MECHANIC solder ball 25000PCS Bottle Notice: XZ25 is Lead solder ball, XZW25 is Lead free Solder ball. The BGA solder ball has the following characteristics: Meet EU ROHS and REACH standards. With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance. Purity and sphericity are very high,