PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC Optional Hardware design :

Optional Hardware design :

Preset functions

Working distance: 50~155mm

Put the phone in Download Mode (power off the phone

Shockproof Foam

PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC Optional Hardware design :PHONEFIX Heating Station + 3 kinds Motherboard Heating groove Features : Brand: PHONEFIX Voltage: 110V 220V Demolition shield temperature adjustment 180 220 In addition to CPU side glue temperature 180 220 Demolition A8 A9 A10 A11CPU the temperature 230 240 Desmearing temperature 180 200 Reballing BGA chip temperature 180 200 Soldering A8 A9 A10 A11 CPU temperature 190 210 Optional Types : 120X MAX ( 3 IN 1 ) for iPhone X XS XS MAX Double Layers Board